COMMON ABBREVIATIONS AND ACRONYMS |
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AC - alternating current AID - analog-to-digital AEC - architect, engineer and constructor Al - artificial intelligence ANDF - architecture neutral distribution format ASCI - application specific integrated crcult API - application programming interface ATG - automatic tank gauge BCD - binary coded decimal BPS - bits per second CAD - computer-aided design CAE - computer-aided engineering CAM - computer-aided manufacturing CASE - computer-aided software engineering CIC - center-to-center CFC - chlorofluorocarbon CIE - computer integrated enterprise CIM - computer integrated manufacturing CIP - clean in place CJC - cold junction compensation CMOS - complementary metal oxide semi-conductor CNC - computer numerical control CPU - central processing unit CRC - cydec redundancy check CRT - cathode ray tube CSA - Canadian Standards Association CT - current transformer D/A - digital-to-analog DAS - data acquisitions system DC - direct current DCE - distributed computing environment DCS - distributed control system DES - discrimination expert system DIP4 - Deutsches Institute fur Normung DMA - direct memory access DNC - direct numerical control DOS - disk operating system DP - differential pressure DPDT - double pole, double throw DPM - digital panel meter DRAM - dynamic random access memoey EHL - effective heated length EMI - electro magnetic interference EMS - expanded memory specification EPA - enhanced performance architecture EPROM - erasable,programmable read-only memory ERP - enterprise resource planning ES - expert system EVOP - evolutionary operations EWMA - exponentially weighted moving average FCS - Field control station |
FFT - fast Fourier transform FIA - flaw injection analysis FID - flame ionization detector FIP - factory information protocol FMS - flexible manufacturing system FS - full scale FTIR - Fourter transform infrared GC - gas chroniatograph GPIB - general purpose interface bus GUI - graphical user interface HCFC - hydrochlorofluorocarbon HPLC - high pressure liquid chromatography HPV - high performance vane HTG - hydrostatic tank gauge IC - integrated circuit I/O - input/output ID - inside diameter I/P - current-to-pneumatic IR - infrared IS - lntrinsic safety JIT - Just-in-time LAN - Local area network LC - liquid chromatograph LCD - liquid crystal display LCL - lower control unit LDES - linear discrimination expert system LED - light emitting diode LEL - Lower explosive limit LIMS - laboratoiy information management system LP - Linear programming MACT - maxmum achievable control technology MAP - manufacturing automation protocol MGO - magnesium oxide MIPS - millions instructions per second MIS - management information services MMI - man machine interface MMS - manufacturing message system MTBF - meantime between failures MTTD - mean time to detect MTTF - mean time to fail MODEM - modulating/demodulatlng module MPCS - manufacturing planning and control software MRP - material requirements planning MRP II - manufacturIng resource planning NC - normally closed NC - numerical control NDIR - non-dispersive infrared NIR - near infrared NO - normally open OCR - optical character recognition OD - outside diameter OEM - original equipment manufacturer |
OI - operator interface 00D - object oriented design OOP - object oriented programming 0SI - open systems interconnection P&ID - piping and instrumentation diagram PB - proportional band PC - personal computer or programmable controller PD - positive displacement P/I - pneumatic-to-current P1 - proportional-integral PID - proportianal-integral-derivative PLC - programmable logic controller PROM - programmable logic controller PSA - pressure sensitive adhesive PRV - pressure reducing valve PV - process variable or process value QC - quality control R&D - research and development RAM - random access memory RF - radio frequency RFI - radio frequency lnterference RH - relative humidity RMS - root mean square ROM - read-only memory RSS - root sum squared RTD - resistance temperature detector RTU - remote terminal unit RV - relief valve SCADA - eupervisory control and data acquisition SCR - silicon controlled rectifier SFC - supercritical fluid chromatography SNA - systems networking architecture SP - set point SPC - statistical process control SPDT - single pole, double throw SQC - statistical quality control SSR - solid state relay SSC - single station controller SV - set point value TIC - thermocouple TCD - thermal conductivity detector THD - total harmonic distortion TOP - technical office protocol TPM - total predictive maintenance TQC - total quality control TVSS - transient voltage surge suppressor UCL - upper control limit UPS - uninterruptible power supply UV - ultraviolet VDT - video display terminal VFD - variable frequency drive VME - virtual memory executive system WAN - wide area network WIP - work-in-process |
| WARRANTY: CEMELECTRIC makes no warranties or representations of any sort regarding the fitness for use, or the application of its products by the Purchaser. The selection, application or use of CEMELECTRIC products is the Purchaser's responsibility. CEMELECTRIC products are warranted to be free from defects in material and workmanship. CEMELECTRIC's sole responsibility under this warranty is to repair or replace, free of charge, F.O.B. its factory, items determined by CEMELECTRIC to be defective. The period of the warranty is one year from the manufacturing date, or three years for products so marked. Some additional time is extended for items purchased through and stocked by authorized CEMELECTRIC Service Centers. All warranties exist between CEMELECTRIC and the first party Purchaser. No claims will be allowed for labor, material, loss of profit or damages in shipping, handling, in Installation or by abuse. CEMELECTRIC will not honor back charges for any alterations, modifications or revisions of any kind. CEMELECTRIC cannot warranty any immersion heater against failure by sheath corrosion if caused by operating conditions beyond the con- trol of CEMELECTRIC. The ultimate selection of sheath and other immer- sion heater component materials are the responsibility of the Purchaser. |
RETURNS: No products returned can be accepted without a
completed Return Material Authorization form.
Variance In Quantity (VIQ):
There is no overshipment on items with a net value over $125.
However, certain items of extraordinary difficulty may exceed
above VIQ.
Monel, lncoloy and Inconel are trademarks of the Inco family of companies.
Teflon, end Kapton are trademarks of E.I. Du Pont de Nemours & Company.
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